Snapshot

Why Hyderabad is iconic:
Hyderabad’s E-City (Electronic City) at Maheshwaram is envisioned as India’s largest integrated ESDM park, spanning over 600 acres. Telangana has rapidly emerged as a semiconductor design powerhouse, hosting 200+ design houses, global R&D centers, and leading EMS providers. The cluster is central to India’s semiconductor ecosystem, with upcoming fabs, ATMP (Assembly, Testing, Marking & Packaging) units, and component manufacturing facilities.

Industrial edge:

• Telangana contributes >30% of global chip design talent through R&D centers of Intel, AMD, Qualcomm, Micron, and MediaTek.
  
• Dedicated electronics manufacturing clusters (EMC) at E-City and Maheshwaram with plug-and-play units.
  
• State-backed TS-iPASS policy, single-window clearance, and attractive subsidies for electronics & semiconductor investments.
  

Scale: Home to the Micron ATMP facility ($2.75B investment), Foxconn and OnePlus manufacturing projects, and India’s first semiconductor fab proposals under India Semiconductor Mission (ISM).

Product Range

Category	Key Products
Semiconductor Design Services	ASICs, SoCs, FPGA, analog/mixed-signal IC design
EMS & PCB Manufacturing	High-mix, low-volume electronics, automotive/industrial PCBs
ATMP Facilities	Chip packaging, die attach, testing & marking
Component Manufacturing	Passive components, connectors, sensors
Consumer Electronics EMS	Smartphones, IoT devices, wearables
R&D & Prototyping	Hardware validation labs, embedded system design

Cluster Strengths

Feature	Details
Semiconductor Design Capital	200+ chip design companies, 1,50,000+ VLSI engineers
Government Policy Support	TS-iPASS, Electronics Policy 2020, India Semiconductor Mission (ISM)
World-Class Infrastructure	E-City with 600+ acres, built-to-suit industrial spaces, and logistics hubs
ATMP & Fab Proposals	Micron ATMP, Foxconn ATMP, ISM-backed semiconductor fabs
Strategic Location	Close to Hyderabad Airport (30 mins), ORR, and pharma/IT corridors
Talent Ecosystem	IIIT Hyderabad, IIT Hyderabad, and Osmania University producing chip design talent

Materials & Sustainability

Key Materials: Semiconductor wafers, PCB laminates, IC packages, chemicals for fab/ATMP, precision tooling.

Sustainability Edge:

• ATMP units with zero liquid discharge (ZLD) and cleanroom standards
  
• Solar-based power integration and water recycling infrastructure
  
• Telangana Green Industrial Parks with tree-cover and carbon-neutral goals
  
• Focus on sustainable electronics supply chains and RoHS compliance
  

Cluster Infrastructure

• Industrial Parks:
  
  • E-City, Maheshwaram (600 acres) – ATMP, fab, and EMS focus
    
  • ELICO Industrial Estate – legacy electronics hub
    
  • Hardware Park, Shamshabad – IT hardware, PCB, and electronics
    
• Institutions:
  
  • C-DAC Hyderabad, SAMEER, IIIT-H, IIT Hyderabad, TASK (Telangana Academy for Skill & Knowledge)
    
• Connectivity:
  
  • Shamshabad International Airport (Rajiv Gandhi International Airport)
    
  • ORR expressway connectivity to Bangalore Highway
    
  • Inland Container Depots (ICDs) at Hyderabad
    

Compliance & Certifications

• ISO 9001, ISO 14001, ISO/IEC 27001, IATF 16949 for automotive electronics
  
• CE, FCC, UL certifications for international markets
  
• SEMI S2 standards for fab safety
  
• NABL-accredited PCB and IC validation labs
  
• RoHS, WEEE, and REACH compliance for exports
  

Production Timelines & MOQs

Product Type	Sampling Lead Time	Bulk Lead Time	MOQ Guidance
PCB Assemblies (EMS)	1–2 weeks	3–5 weeks	5,000+ boards per SKU
Semiconductor Packaging (ATMP)	2–3 weeks	4–8 weeks	Project-based (chip lots)
IoT Devices & Prototypes	2 weeks	4–6 weeks	2,000+ devices
Components (Sensors, Connectors)	2 weeks	5–7 weeks	5,000–10,000 pcs
Consumer Electronics Assembly	2–3 weeks	4–6 weeks	5,000+ units

Branding & Packaging

• Branding: Laser-engraved part codes, QR codes for traceability, custom anti-counterfeit labels
  
• Packaging:
  
  • ESD-safe trays and vacuum-sealed bags for ICs
    
  • MBB (Moisture Barrier Bags) with desiccants for PCBs
    
  • Shock-resistant crates for bulk electronics and testing equipment
    

Quality Control (IndiaUnbox Protocol)

• Cleanroom monitoring for fabs and ATMP lines
  
• Automated Optical Inspection (AOI) and X-ray for PCB assembly
  
• Semiconductor burn-in testing, wafer-level inspection
  
• ESD-compliant handling and export packaging
  
• Full lot traceability with digital inspection certificates
  

Price Drivers

• Semiconductor wafer and packaging costs
  
• High CAPEX in ATMP and fab units
  
• Labor and automation mix for EMS facilities
  
• Import duties on critical components vs. PLI incentives
  
• Freight and packaging for sensitive semiconductor shipments
  

Buyer Confidence Signals

• Micron ATMP facility: $2.75B investment (India’s first high-volume memory packaging unit)
  
• Telangana is India’s semiconductor design capital, contributing 30%+ of global chip design talent
  
• Hyderabad is a preferred location for fabs and ATMP under ISM due to stable power and infrastructure
  
• Close integration with Hyderabad’s IT corridor for embedded software and hardware co-design
  

State offers world-class plug-and-play industrial parks for electronics, similar to Taiwan’s science parks